US Patent Issued to UNITED MICROELECTRONICS on June 23 for "Semiconductor structure and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,939, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor structure and fabrication method thereof" was invented by Chu-Fu Lin (Kaohsiung City, Taiwan), Chuan-Lan Lin (Chiayi City, Taiwan), Yu-Ping Wang (Hsinchu City, Taiwan) and Chun-Hung Chen (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a bottom wafer having a bottom substrate and a bottom interconnect structure on the bottom substrate, and a top wafer having a top substrate with a front surface and a rear surface and a top interconnect structure disposed on the front surface of the top su...