Exclusive

Publication

Byline

Location

US Patent Issued to DISCO on June 23 for "Chip treating method" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,923, issued on June 23, was assigned to DISCO Corp. (Tokyo). "Chip treating method" was invented by Masaru Nakamura (Tokyo). According to ... Read More


US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 23 for "Semiconductor device manufacturing assembly for solder bump formation using a wafer with ring" (Japanese, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,924, issued on June 23, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Semiconductor device manufacturing as... Read More


US Patent Issued to ASM IP Holding on June 23 for "Jigs and methods of teaching substrate handling in semiconductor processing systems using jigs" (Arizona Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,925, issued on June 23, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Jigs and methods of teaching substrate handling in semi... Read More


US Patent Issued to Lam Research on June 23 for "Anodization for metal matrix composite semiconductor processing chamber components" (American, Indian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,926, issued on June 23, was assigned to Lam Research Corp. (Fremont, Calif.). "Anodization for metal matrix composite semiconductor process... Read More


US Patent Issued to Lam Research on June 23 for "Semiconductor processing chucks featuring recessed regions near outer perimeter of wafer for mitigation of edge/center nonuniformity" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,927, issued on June 23, was assigned to Lam Research Corp. (Fremont, Calif.). "Semiconductor processing chucks featuring recessed regions n... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Apparatus and methods for three dimensional reticle defect smart repair" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,928, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Apparatus and methods for three dim... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "System and method for detecting defects on a wafer and related non-transitory computer-readable medium" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,929, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "System and method for detecting... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor chip and semiconductor package with planar surfaces recess structure and lower dielectric isolation" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,930, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor chip and semiconductor package... Read More


US Patent Issued to KLA on June 23 for "System and method for monitoring parameters of a semiconductor factory automation system" (Israeli, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,931, issued on June 23, was assigned to KLA Corp. (Milpitas, Calif.). "System and method for monitoring parameters of a semiconductor facto... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Method of forming semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,932, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of forming semiconductor... Read More