US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 23 for "Semiconductor device manufacturing assembly for solder bump formation using a wafer with ring" (Japanese, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,924, issued on June 23, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor device manufacturing assembly for solder bump formation using a wafer with ring" was invented by Takashi Noma (Ota, Japan), Noboru Okubo (Kumagaya-City, Japan) and Yusheng Lin (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "At least one circuit element may be formed on a front side of a ringed substrate, and the ringed substrate may be mounted on a mounting chuck. The mounting chuck may have an inner raised portion configured to receive the thinned portion of the substrate thereon, and a recessed ring around a perimeter of the ...