US Patent Issued to Lam Research on June 23 for "Semiconductor processing chucks featuring recessed regions near outer perimeter of wafer for mitigation of edge/center nonuniformity" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,927, issued on June 23, was assigned to Lam Research Corp. (Fremont, Calif.).

"Semiconductor processing chucks featuring recessed regions near outer perimeter of wafer for mitigation of edge/center nonuniformity" was invented by Ravi Vellanki (San Jose, Calif.), Eric H. Lenz (Livermore, Calif.) and Yu Pan (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Chucks for supporting semiconductor wafers during certain processing operations are disclosed. The chucks may include a recessed region near the outer perimeter of the wafer that has one or more surfaces that face towards the wafer but are recessed therefrom so as to not contact the w...