US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Apparatus and methods for three dimensional reticle defect smart repair" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,928, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Apparatus and methods for three dimensional reticle defect smart repair" was invented by Po-Chien Huang (Hsinchu, Taiwan), Chung-Hung Lin (Hsinchu, Taiwan) and Chih-Wei Wen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more embodiments of the present disclosure describe an artificial intelligence assisted substrate defect repair apparatus and method. The AI assisted defect repair apparatus employs an object detection algorithm. Based on the plurality of images taken by detectors located at different respective positions, t...