ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,744, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Multi-metal fill with self-aligned ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,745, issued on July 28, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Composite contact between backside power ele... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,746, issued on July 28, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Backside BPR/BSPDN integration with backside... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,747, issued on July 28, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Kengo Ohmori (Kyoto, Japan). ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,748, issued on July 28, was assigned to GLOBAL TECHNOLOGIES Co. LTD. (South Korea). "Light source device and display apparatus having the s... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,749, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit semiconductor device" was... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,750, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Nanosheet semiconductor device having a thro... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,751, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit devices" was invented by ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,752, issued on July 28, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method for manufacturing the same" was... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,753, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More