US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,753, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Fong-Yuan Chang (Hsinchu, Taiwan), Noor Mohamed Ettuveettil (Hsinchu, Taiwan), Po-Hsiang Huang (Tainan City, Taiwan), Sen-Bor Jan (Tainan City, Taiwan), Ming-Fa Chen (Taichung City, Taiwan), Chin-Chou Liu (Xinfeng Township, Taiwan) and Yi-Kan Cheng (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallizatio...