ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,734, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Patterning a semiconductor substrate" was invented by Alexandra Krawi... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,735, issued on July 28, was assigned to DISCO Corp. (Tokyo). "Inspecting apparatus, peeling apparatus, and learned model generating method"... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,736, issued on July 28, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Chip-on-wafer face-to-back hybrid bonding witho... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,737, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Compressive films for large area gapfill" was invent... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,738, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Transistor device with sinker contacts and methods for manufactur... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,739, issued on July 28, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Handler wafer with low overlay residual back... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,740, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus and methods for bonding materials" was inv... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,741, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device and method" wa... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,742, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including metal lines h... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,743, issued on July 28, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method" was invented by Kana Tahara ... Read More