US Patent Issued to Applied Materials on July 28 for "Apparatus and methods for bonding materials" (California, Montana Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,740, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Apparatus and methods for bonding materials" was invented by Wen Xiao (San Jose, Calif.), Ming-Jui Li (Sunnyvale, Calif.), Michelle Tjakradinata (San Jose, Calif.), Harish Varma Penmethsa (Dublin, Calif.) and Jeffrey Ivan Turner (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for preparing a surface for bonding leverages multiple treatment processes to increase bonding strength. The method may include performing a first treatment process on a surface of a material using a first plasma process to promote diffusion into the first surface of...