ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,723, issued on July 28, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Contactless conveyor device" was invented by Stefan Teusch... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,724, issued on July 28, was assigned to Canon K.K. (Tokyo). "Systems, devices, and methods for compensating for shape variations when using... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,725, issued on July 28, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands). "Method, apparatus, and system for wafer grounding"... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,727, issued on July 28, was assigned to Ciena Corp. (Hanover, Md.). "Managing semiconductor wafer and die handling" was invented by Martin ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,728, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and mechanisms for coupling sensors to trans... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,729, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Robot blade having multiple sensors... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,730, issued on July 28, was assigned to Nikkiso Co. Ltd. (Tokyo). "Susceptor and method for manufacturing nitride semiconductor light-emitt... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,731, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Substrate processing apparatus and method" w... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,732, issued on July 28, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device, method of testing the same, and method of... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,733, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More