ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,731, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Substrate processing apparatus and method" was invented by Hyung Jun Choi (Suwon-si, South Korea) and Tae Hong Min (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate; and a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure. The plurality of pins include a plurality of first pins in the first region and are configured to be...