US Patent Issued to ASML Netherlands on July 28 for "Method, apparatus, and system for wafer grounding" (Dutch, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,725, issued on July 28, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands).

"Method, apparatus, and system for wafer grounding" was invented by Yixiang Wang (Fremont, Calif.), Shibing Liu (San Jose, Calif.), Shanhui Cao (San Jose, Calif.), Kangsheng Qiu (San Jose, Calif.), Juying Dou (San Jose, Calif.), Ying Luo (San Jose, Calif.), Yinglong Li (San Jose, Calif.), Qiang Li (Campbell, Calif.), Ronald Van Der Wilk (Knegsel, Netherlands) and Jan-Gerard Cornelis Van Der Toorn (Eindhoven, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A f...