US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Robot blade having multiple sensors for multiple different alignment tasks" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,729, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Robot blade having multiple sensors for multiple different alignment tasks" was invented by Wen-Hao Cheng (Hsinchu, Taiwan) and Yen-Yu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer."

The patent was filed ...