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US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Carrier structure for etch-back silicon-on-insulator process" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,731, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Carrier structure for etch-back silic... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "LDMOS transistor device and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,732, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "LDMOS transistor device and metho... Read More


US Patent Issued to FUJI ELECTRIC on Aug. 4 for "Method of manufacturing silicon carbide semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,733, issued on Aug. 4, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method of manufacturing silicon carbide semiconductor devi... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor device and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,734, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of fa... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Isolation structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,735, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Isolation structures" was invente... Read More


US Patent Issued to The Hong Kong University of Science and Technology on Aug. 4 for "Semiconductor device and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,736, issued on Aug. 4, was assigned to The Hong Kong University of Science and Technology (Hong Kong). "Semiconductor device and method for ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,737, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Jin Youn... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 4 for "Lateral fin field-effect transistors" (Texas Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,738, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Lateral fin field-effect transistors" was invented by Manoj Mehrotr... Read More


US Patent Issued to GE Aviation Systems on Aug. 4 for "Radiation hardened semiconductor power device" (New York Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,739, issued on Aug. 4, was assigned to GE Aviation Systems LLC (Grand Rapids, Mich.). "Radiation hardened semiconductor power device" was in... Read More


US Patent Issued to DENSO on Aug. 4 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,741, issued on Aug. 4, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device and manufacturing method of semiconductor dev... Read More