ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,017, issued on Aug. 11, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Systems and methods for multi-tier multi-die mo... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,018, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method of manufacturing semiconductor device" was invent... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,019, issued on Aug. 11, was assigned to VueReal Inc. (Waterloo, Canada). "Passing signals through micro device sidewalls" was invented by G... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,020, issued on Aug. 11, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan). "Chip package having a glass fiber substrate"... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,021, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manufac... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,022, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Interconnect strips" was invented by Chih-Chien Ho (Plano, Texas)... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,023, issued on Aug. 11, was assigned to NICHIA Corp. (Anan, Japan). "Method of manufacturing semiconductor element" was invented by Hirofum... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,024, issued on Aug. 11, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Package with molding cavity" was inve... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,026, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of man... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,027, issued on Aug. 11, was assigned to WOLFSPEED INC. (Durham, N.C.). "Multilayer encapsulation for humidity robustness and highly acceler... Read More