ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,024, issued on Aug. 11, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Package with molding cavity" was invented by Yong Liu (Cumberland Foreside, Maine), Liangbiao Chen (Scarborough, Maine) and Chee Hiong Chew (Seremban, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-power semiconductor device module is implemented with a cavity in the molding package. The cavity reduces a volume of the molding compound, preventing an accumulation of stress in the module, and associated warpage of the package. Chip assemblies within the module are designed to fit within the cavity, so that semiconductor dies, and sensi...