US Patent Issued to WALTON ADVANCED ENGINEERING on Aug. 11 for "Chip package having a glass fiber substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,020, issued on Aug. 11, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan).

"Chip package having a glass fiber substrate" was invented by Hong-Chi Yu (Kaohsiung, Taiwan), Chun-Jung Lin (Kaohsiung, Taiwan) and Ruei-Ting Gu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package which includes a glass fiber substrate made of FR-4 fiberglass is provided. The chip package further includes a substrate pad which is a stacked metal structure with a certain thickness and composed of a nickel layer, a palladium layer, and a gold layer, or a nickel layer and a gold layer stacked over at least one first circuit layer ...