ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,022, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Interconnect strips" was invented by Chih-Chien Ho (Plano, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming integrated circuit (IC) packages includes mounting dies on a strip of interconnects and applying wire bonds in regions of the strip of interconnects proximate to mold shields. The method also includes adjusting the mold shields of the strip of interconnects. The method includes flowing a mold compound on the strip of interconnects to form a strip of IC packages. Mold injection pressure causes the mold compound to flow from a first end of the stri...