US Patent Issued to WOLFSPEED on Aug. 11 for "Multilayer encapsulation for humidity robustness and highly accelerated stress tests and related fabrication methods" (North Carolina Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,027, issued on Aug. 11, was assigned to WOLFSPEED INC. (Durham, N.C.).

"Multilayer encapsulation for humidity robustness and highly accelerated stress tests and related fabrication methods" was invented by Kyoung-Keun Lee (Cary, N.C.), Daniel Etter (Durham, N.C.), Fabian Radulescu (Chapel Hill, N.C.), Scott Sheppard (Chapel Hill, N.C.) and Daniel Namishia (Wake Forest, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes a semiconductor body, and a multi-layer environmental barrier on the semiconductor body. The multi-layer environmental barrier includes a plurality of sublayers that are stacked on the semiconductor body....