US Patent Issued to Advanced Micro Devices on Aug. 11 for "Systems and methods for multi-tier multi-die modules" (California, Colorado, Texas Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,017, issued on Aug. 11, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Systems and methods for multi-tier multi-die modules" was invented by Chandra Sekhar Mandalapu (Fort Collins, Colo.), Rahul Agarwal (Santa Clara, Calif.) and Raja Swaminathan (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed computer-implemented method for multi-tier multi-die modules may include bonding a front side of a first plurality of dies to a first carrier, forming a first wafer; preparing a back-side surface of the first wafer for hybrid bonding; bonding a back side of a second plurality of dies to a second carrier, forming ...