ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,975, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan). "Wafer level multi-die structure form... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,976, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Structures and methods for reducing... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,977, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,978, issued on Aug. 11, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Memory device and fabricating method thereof" wa... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,979, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor device having an isolation regi... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,980, issued on Aug. 11, was assigned to Medtronic Inc. (Minneapolis). "Integrated circuit package and medical device including same" was in... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,981, issued on Aug. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming shielding material... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,982, issued on Aug. 11, was assigned to NXP B.V. (Eindhoven, Netherlands). "Jitter applied detection for semiconductor secure element" was ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,983, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Akira Hirao (Matsu... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,984, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Substrate barcode readability enhancement structure... Read More