ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,904, issued on Aug. 11, was assigned to TRUSTEES OF DARTMOUTH COLLEGE (Hanover, N.H.). "Liquid metal printed 2D ultrahigh mobility conducti... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,905, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of manufacturing semicon... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,906, issued on Aug. 11, was assigned to Versum Materials US LLC (Tempe, Ariz.). "Selective thermal atomic layer deposition" was invented by... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,907, issued on Aug. 11, was assigned to Yale University (New Haven, Conn.). "Control and localization of porosity in III-nitrides and metho... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,908, issued on Aug. 11, was assigned to Resonac Corp. (Tokyo). "Etching method and semiconductor element manufacturing method" was invented... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,909, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching method" was invented by Maju Tomura (Miyagi, Japan), Takatosh... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,910, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Hard mask layer and formation m... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,911, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Introduction of metal in hard mask for high aspect r... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,912, issued on Aug. 11, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,913, issued on Aug. 11, was assigned to SEMES Co. Ltd. (Cheonan-si, South Korea). "Apparatus and method for processing substrate using supe... Read More