ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,912, issued on Aug. 11, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).
"Plasma diced wafers and methods thereof" was invented by Dzafir Bin Mohd Shariff (Singapore), Enrique E. Sarile Jr. (Singapore), Jackson Fernandez Rosario (Singapore), Ronnie M. De Villa (Singapore), Chan Loong Neo (Singapore) and Il Kwon Shim (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Reliable plasma dicing of a processed wafer with a die attach film (DAF) attached to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dic...