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US Patent Issued to ASM IP Holding on Aug. 25 for "Selective deposition" (Arizona Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,126, issued on Aug. 25, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Selective deposition" was invented by Krzysztof Kamil K... Read More


US Patent Issued to CARBONCOMPETENCE, YG-1 on Aug. 25 for "Method for applying a doped diamond layer to a substrate by chemical vapour deposition" (Austrian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,127, issued on Aug. 25, was assigned to CARBONCOMPETENCE GMBH (Wattens, Austria) and YG-1 Co. LTD. (Incheon, South Korea). "Method for appl... Read More


US Patent Issued to Applied Materials on Aug. 25 for "Coating interior surfaces of complex bodies by atomic layer deposition" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,128, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Coating interior surfaces of complex bodies by atomi... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Atomic layer deposition tool and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,129, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Atomic layer deposition tool and me... Read More


US Patent Issued to BENEQ on Aug. 25 for "Precursor source arrangement and atomic layer deposition apparatus" (Finnish Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,130, issued on Aug. 25, was assigned to BENEQ OY (Espoo, Finland). "Precursor source arrangement and atomic layer deposition apparatus" was... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Deposition methods using pulsed plasma with varying pulse frequency" (American, Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,131, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Deposition methods using pulsed plasma with varying pulse frequency" ... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Substrate processing apparatus and substrate removal method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,132, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate removal method" was inve... Read More


US Patent Issued to Atotech Deutschland on Aug. 25 for "Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards" (German Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,133, issued on Aug. 25, was assigned to Atotech Deutschland GmbH & Co. KG (Berlin). "Process for wet-chemical formation of a stable tin oxi... Read More


US Patent Issued to NIPPON STEEL on Aug. 25 for "Grain-oriented electrical steel sheet and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,134, issued on Aug. 25, was assigned to NIPPON STEEL Corp. (Tokyo). "Grain-oriented electrical steel sheet and manufacturing method therefo... Read More


US Patent Issued to The United States of America as represented by the Secretary of the Army on Aug. 25 for "Pump free alkaline electrolyte membrane water electrolytic device" (Maryland Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,135, issued on Aug. 25, was assigned to The United States of America as represented by the Secretary of the Army (Washington). "Pump free a... Read More