US Patent Issued to Tokyo Electron on Aug. 25 for "Substrate processing apparatus and substrate removal method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,132, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate removal method" was invented by Akihiro Kuribayashi (Yamanashi, Japan), Kentaro Oshimo (Yamanashi, Japan), Hyunyoung Go (Yamanashi, Japan), Yudo Sugawara (Iwate, Japan) and Akashi Fujio (Iwate, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate-processing-apparatus includes a processing-vessel to accommodate a substrate and to process the substrate; a substrate-support that is provided inside the processing-vessel and has a mounting-surface on which the substrate is mounted; and a lift-pin-mechanism that includes a lift-pi...