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US Patent Issued to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION on Aug. 25 for "Vacuum packaging manufacturing method and semiconductor devices manufactured thereby" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,057, issued on Aug. 25, was assigned to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION (Seoul, South Korea). "Vacuum packaging manufacturing met... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,058, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More


US Patent Issued to Applied Materials on Aug. 25 for "Titanium nitride gapfill processes for semiconductor structures" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,059, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Titanium nitride gapfill processes for semiconductor... Read More


US Patent Issued to Geminatio on Aug. 25 for "Generation of multiline etch substrates" (Colorado Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,060, issued on Aug. 25, was assigned to Geminatio Inc. (N.Y.). "Generation of multiline etch substrates" was invented by Brennan Peterson (... Read More


US Patent Issued to Applied Materials on Aug. 25 for "Treatments to enhance material structures" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,061, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Treatments to enhance material structures" was inven... Read More


US Patent Issued to Applied Materials on Aug. 25 for "Methods to improve oxide sidewall quality" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,062, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods to improve oxide sidewall quality" was inven... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Method of forming silicon nitride film and film forming apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,063, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of forming silicon nitride film and film forming apparatus" wa... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Manufacturing method for semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,064, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Manufacturing method for semiconductor device" was invented by Kiyota... Read More


US Patent Issued to KOKUSAI ELECTRIC on Aug. 25 for "Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,065, issued on Aug. 25, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of processing substrate, method of manufacturing semiconduc... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Aluminum nitride dipole dopant film for tuning multi-VT devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,066, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Aluminum nitride dipole dopant film... Read More