US Patent Issued to Geminatio on Aug. 25 for "Generation of multiline etch substrates" (Colorado Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,060, issued on Aug. 25, was assigned to Geminatio Inc. (N.Y.).

"Generation of multiline etch substrates" was invented by Brennan Peterson (Longmont, Colo.) and Phillip D. Hustad (Longmont, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of microfabrication includes providing a first relief pattern on a target layer, wherein the first relief pattern comprises a first resist having a first etch selectivity, coating the first relief pattern with a solubility-shifting agent, depositing a second resist on the first relief pattern, wherein the second resist has a second etch selectivity that is different from the first etch selectivity, diff...