US Patent Issued to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION on Aug. 25 for "Vacuum packaging manufacturing method and semiconductor devices manufactured thereby" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,057, issued on Aug. 25, was assigned to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION (Seoul, South Korea).

"Vacuum packaging manufacturing method and semiconductor devices manufactured thereby" was invented by Woo Young Choi (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vacuum packaging manufacturing method includes forming, on a silicon wafer, a lower layer including a first metal layer and a second metal layer formed on the first metal layer, forming anchor regions by etching parts of the second metal layer and depositing a dielectric layer on the second metal layer in which the anchor regions are formed, exposing a silicon oxi...