ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,498, issued on Sept. 8, was assigned to CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION (Seoul, South Korea). "Direct cooling... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,499, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies having integrated thin film capacito... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,500, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Seal structures including passi... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,501, issued on Sept. 8, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device package and meth... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,502, issued on Sept. 8, was assigned to LX SEMICON Co. LTD. (Daejeon, South Korea). "Chip-on-film package and display device including the ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,503, issued on Sept. 8, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device package and meth... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,504, issued on Sept. 8, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufact... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,505, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Laser detecting circuit and semiconductor ap... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,506, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor die package and metho... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,507, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and manufacturing... Read More