US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 8 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,504, issued on Sept. 8, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Yen-Yu Chu (Taichung City, Taiwan), Tsung-Yu Huang (Taichung City, Taiwan), Kuo-Hua Tseng (Taichung City, Taiwan), Tsung-Xin Chien (Taichung City, Taiwan) and Chang-Ku-Yuan Sie (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic component and conductors are disposed on a substrate structure, and the electronic component and the conductors are covered by an encapsulation layer. A conductive layer is fo...