US Patent Issued to CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION on Sept. 8 for "Direct cooling device for integrated circuit and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,498, issued on Sept. 8, was assigned to CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION (Seoul, South Korea).

"Direct cooling device for integrated circuit and manufacturing method thereof" was invented by Min Soo Kang (Seoul, South Korea), Jun Rae Park (Ansan-si, South Korea), Hae Cheon Kim (Daejeon, South Korea), Hyoung Soon Lee (Seoul, South Korea), Sung Jae Chang (Daejeon, South Korea), Hyun Wook Jung (Daejeon, South Korea), Il Gyu Choi (Jeonju-si, South Korea), Seong Il Kim (Daejeon, South Korea), Sang Heung Lee (Daejeon, South Korea), Ho Kyun Ahn (Daejeon, South Korea) and Jong Won Lim (Daejeon, South Korea).

According to the abstract* released by the U.S. Pat...