US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Seal structures including passivation structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,500, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Seal structures including passivation structures" was invented by Chun Yu Chen (Hsinchu, Taiwan) and Yen Lian Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a substrate that has a device region and a ring region surrounding the device region, an interconnect structure disposed on the substrate, a first passivation layer disposed over the interconnect structure, a first contact via ring embedded in th...