US Patent Issued to LX SEMICON on Sept. 8 for "Chip-on-film package and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,502, issued on Sept. 8, was assigned to LX SEMICON Co. LTD. (Daejeon, South Korea).

"Chip-on-film package and display device including the same" was invented by Seung Hoon Jin (Daejeon, South Korea) and Min Ho Jeon (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a chip-on-film package capable of preventing damage to a surface thereof. The chip-on-film package includes a flexible base film, a first metal wiring layer formed on a first surface of the base film, a first surface insulating layer formed on the first metal wiring layer, a semiconductor chip connected to the first metal wiring layer through an opening form...