US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Semiconductor die package and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,506, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor die package and methods of formation" was invented by Tsung-Hao Yeh (Hsinchu City, Taiwan), Chien Hung Liu (Hsinchu County, Taiwan), Hsien Jung Chen (Tainan City, Taiwan), Hsin Heng Wang (Hsinchu County, Taiwan) and Kuo-Ching Huang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through ...