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US Patent Issued to LAM RESEARCH on Sept. 8 for "Apparatus for processing a wafer" (Austrian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,448, issued on Sept. 8, was assigned to LAM RESEARCH AG (Villach, Austria). "Apparatus for processing a wafer" was invented by Michael Brug... Read More


US Patent Issued to VAT Holding on Sept. 8 for "Pin lifting device" (Austrian Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,449, issued on Sept. 8, was assigned to VAT Holding AG (Haag, Switzerland). "Pin lifting device" was invented by Michael Dur (Hohenweiler, ... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Multi-material chuck" (New York Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,450, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Multi-material chuck" was invented by Christopher Netzband (Albany, N... Read More


US Patent Issued to SCREEN Holdings on Sept. 8 for "Substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,451, issued on Sept. 8, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing apparatus" was invented by Shinichi ... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Cassette structures and related methods for batch processing in epitaxial deposition operations" (American, Indian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,452, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Cassette structures and related methods for batch pr... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Susceptor assembly thermal break and methods for cooling a susceptor assembly" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,453, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Susceptor assembly thermal break and methods for coo... Read More


US Patent Issued to United Semiconductor (Xiamen) on Sept. 8 for "Method for detecting back surface of wafer" (Singaporean, Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,454, issued on Sept. 8, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Xiamen, China). "Method for detecting back surface of wafer... Read More


US Patent Issued to Yamaha Robotics on Sept. 8 for "Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,455, issued on Sept. 8, was assigned to Yamaha Robotics Co. Ltd. (Tokyo). "Inspection device, mounting apparatus, inspection method, and no... Read More


US Patent Issued to HAMAMATSU PHOTONICS on Sept. 8 for "Manufacturing method, inspection method, and inspection device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,456, issued on Sept. 8, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "Manufacturing method, inspection method, and inspecti... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Systems and methods that use infrared (IR) spectroscopy to monitor process chemicals utilized in a semiconductor process" (Texas, New York Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,457, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Systems and methods that use infrared (IR) spectroscopy to monitor pr... Read More