US Patent Issued to HAMAMATSU PHOTONICS on Sept. 8 for "Manufacturing method, inspection method, and inspection device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,456, issued on Sept. 8, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Manufacturing method, inspection method, and inspection device" was invented by Tomonori Nakamura (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor device includes: a first step of forming a laminated film by growing crystals on a sapphire substrate, forming an insulating film on a laminated film, and forming contact holes at an electrical connection point of an n-GaN layer and an electrical connection point of a p-GaN layer in the insulating film to produce a first member; a second step of forming a conducti...