ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,492, issued on Sept. 8, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Integrated circuit package heat sink" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,493, issued on Sept. 8, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Power semiconductor device and manufacturing method" was... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,494, issued on Sept. 8, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor element bonding portion and semiconductor ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,495, issued on Sept. 8, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea). "Power module including multiple layers having varied ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,496, issued on Sept. 8, was assigned to POWER MASTER SEMICONDUCTOR Co. LTD. (Cheongju-si, South Korea). "Semiconductor device" was invented... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,497, issued on Sept. 8, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Method of direct cooling using a cond... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,498, issued on Sept. 8, was assigned to CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION (Seoul, South Korea). "Direct cooling... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,499, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies having integrated thin film capacito... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,500, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Seal structures including passi... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,501, issued on Sept. 8, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device package and meth... Read More