US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 8 for "Method of direct cooling using a conductive strip" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,497, issued on Sept. 8, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Method of direct cooling using a conductive strip" was invented by Ingoo Kang (Gwangsan-gu, South Korea), Oseob Jeon (Seoul, South Korea) and Seungwon Im (Bucheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a semiconductor die disposed on a three-layer substrate. The three-layer substrate includes a ceramic layer disposed between a top metal layer and a bottom metal layer. The semiconductor die is disposed on the top metal layer. An array of mesas is defined in the bottom metal layer with grooves between the mesas ...