US Patent Issued to STMicroelectronics (Grenoble 2) on Sept. 8 for "Integrated circuit package heat sink" (French Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,492, issued on Sept. 8, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Integrated circuit package heat sink" was invented by Romain Coffy (Voiron, France) and Jerome Lopez (Saint Jean de Moirans, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes an electronic chip having a face covered with a thermal interface material layer. A heat sink includes a mounting area fixed to the chip via the thermal interface material layer. The heat sink includes open notches extending into the mounting area to delimit fins separated from each other by the open notches."

The patent was filed on Sept. 11, 202...