Exclusive

Publication

Byline

Location

US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate processing system and maintenance method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,432, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing system and maintenance method" was invented by T... Read More


US Patent Issued to Sony Semiconductor Solutions on Sept. 8 for "Semiconductor apparatus, temperature compensation system, and alarm system" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,433, issued on Sept. 8, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor apparatus, temperature compens... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Measurement jig and processing method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,434, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Measurement jig and processing method" was invented by Masakazu Yamam... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Redistribution layer metallic layout structure and method with warpage reduction" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,435, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Redistribution layer metallic l... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Multi-zone platen temperature control" (Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,436, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Multi-zone platen temperature control" was invented ... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate processing system and substrate transfer method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,437, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing system and substrate transfer method" was invent... Read More


US Patent Issued to Daifuku on Sept. 8 for "Article elevating device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,438, issued on Sept. 8, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Article elevating device" was invented by Hiroshi Otsuka (Hinocho... Read More


US Patent Issued to SEMES on Sept. 8 for "Apparatus for treating substrate and method for treating substrate" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,439, issued on Sept. 8, was assigned to SEMES Co. Ltd. (Cheonan-si, South Korea). "Apparatus for treating substrate and method for treating... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "System and method for automated wafer carrier handling" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,440, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "System and method for automated waf... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate transfer method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,441, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer method" was invented by Nanako Shinoda (Yamanashi,... Read More