US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate transfer method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,441, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate transfer method" was invented by Nanako Shinoda (Yamanashi, Japan) and Shinya Okano (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transfer method includes receiving first and second substrates by a pick of a first transfer device, detecting shift amounts of the first and second substrates, calculating a correction amount of a delivery position of the pick based on the shift amount of the first substrate, and moving the pick to the corrected delivery position to respectively deliver the first and second substrates to a first and second mount...