US Patent Issued to Imec vzw on April 21 for "Metallization process for an integrated circuit" (Belgian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,801, issued on April 21, was assigned to Imec vzw (Leuven, Belgium). "Metallization process for an integrated circuit" was invented by Vic... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 21 for "Method for forming contact structure, semiconductor structure and memory" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,802, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method for forming contact structure, sem... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Semiconductor device structure with reduced critical dimension and method for preparing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,803, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure with reduced cr... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Contact structure, semiconductor device comprising the same, and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,804, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Contact structure, semiconductor device compri... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Semiconductor device with polymer liner and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,805, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with polymer liner and me... Read More

US Patent Issued to Intel on April 21 for "Interconnect structures with nitrogen-rich dielectric material interfaces for low resistance vias in integrated circuits" (Oregon Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,806, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Interconnect structures with nitrogen-rich dielectric materia... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Integrated circuit devices including a back side power distribution network structure and methods of forming the same" (New York, Virginia Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,807, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea). "Integrated circuit devices including a back side pow... Read More

US Patent Issued to Industrial Technology Research Institute on April 21 for "Semiconductor structure including insulating vacancy for improving operation performance and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,808, issued on April 21, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Semiconductor structure including in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Interconnection structure lined by isolation layer" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,809, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnection structure lined b... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,810, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and m... Read More

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