US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Integrated circuit devices including a back side power distribution network structure and methods of forming the same" (New York, Virginia Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,807, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Integrated circuit devices including a back side power distribution network structure and methods of forming the same" was invented by Seungchan Yun (Waterford, N.Y.), Wonhyuk Hong (Clifton Park, N.Y.), Jaejik Baek (Watervliet, N.Y.), Eun Sung Kim (Clifton Park, N.Y.) and Kang-Ill Seo (Springfield, Va.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices and methods of forming the same are provided. The integrated circuit devices may include a transistor including a channel region and a source/drain region contacting the channel region, a powe...