US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,810, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Kuan-Liang Liu (Pingtung County, Taiwan), Chung-Liang Cheng (Changhua County, Taiwan), Yen Liang Wu (Tainan City, Taiwan), Chung-Yuan Li (Taichung City, Taiwan) and Ya Chun Teng (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a first substrate and a second substrate. The first substrate includes a first semiconductor layer, including a first trench isolation that extends...