ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Apparatus for applying a sintering force via a compressible... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,024, issued on April 7, was assigned to Wuhan Tianma Micro-Electronics Co. Ltd. (Wuhan, China) and Wuhan Tianma MicroElectronics Co. Ltd. Sh... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,025, issued on April 7, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China) and HEFEI CHIPMORE TECHNOLOGY Co. LTD. (Heif... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,026, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor packages with patterns of die-specific inform... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,027, issued on April 7, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "Electric circuit body and power conversion device" was i... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,028, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having adhesive membe... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,029, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of for... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,030, issued on April 7, was assigned to Siemens AG (Munich). "Power semiconductor module system and method for producing the power semicond... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,031, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method" w... Read More