ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,946, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Fixtures and methods for positioning process kit compon... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,947, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treating apparatus" was invented by Kenji Amahi... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,948, issued on April 7, was assigned to LAM RESEARCH Corp. (Fremont, Calif.). "Purging spindle arms to prevent deposition and wafer sliding... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,949, issued on April 7, was assigned to NHK SPRING Co. LTD. (Yokohama, Japan). "Stage and method of manufacturing stage" was invented by To... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,950, issued on April 7, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Electrostatic chuck heater and film deposition apparatus" was... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,951, issued on April 7, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Wafer placement table" was invented by Taro Usami (Kasamatsu-... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,952, issued on April 7, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Member for semiconductor manufacturing apparatus" was invente... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,953, issued on April 7, was assigned to DISCO Corp. (Tokyo). "Protective member forming apparatus and method of forming protective member" ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,954, issued on April 7, was assigned to Oki Electric Industry Co. Ltd. (Tokyo). "Electronic structure and method of manufacturing the same"... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,955, issued on April 7, was assigned to EUGENE TECHNOLOGY Co. LTD. (South Korea). "Substrate transfer device and substrate processing appar... Read More