ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,028, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having adhesive membe... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,029, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of for... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,030, issued on April 7, was assigned to Siemens AG (Munich). "Power semiconductor module system and method for producing the power semicond... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,031, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method" w... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,032, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Bilayer memory stacking with lines shared between bottom and to... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,033, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Quasi-monolithic integrated packaging architecture with mid-die... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,034, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic structure including active base substrate with ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,035, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Jin Taek Park (... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,036, issued on April 7, was assigned to Arm Ltd. (Cambridge, Great Britain). "Circuit architecture in multi-dimensional monolithic structur... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,037, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Song-... Read More