ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,037, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Song-Soo Kim (Asan-si, South Korea) and Taeduk Nam (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes first semiconductor chips stacked on a package substrate, a lowermost first semiconductor chip of the first semiconductor chips including a recessed region, and a second semiconductor chip inserted in the recessed region, the second semiconductor chip being connected to the package substrate."
The patent was filed on April 26, 2022, under Application No. 17/729,060.
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