ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,020, issued on April 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Electronic component bonding machines, a... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.). "Homogenous die stacking with increased element density" was inven... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Apparatus for applying a sintering force via a compressible... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,024, issued on April 7, was assigned to Wuhan Tianma Micro-Electronics Co. Ltd. (Wuhan, China) and Wuhan Tianma MicroElectronics Co. Ltd. Sh... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,025, issued on April 7, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China) and HEFEI CHIPMORE TECHNOLOGY Co. LTD. (Heif... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,026, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor packages with patterns of die-specific inform... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,027, issued on April 7, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "Electric circuit body and power conversion device" was i... Read More