US Patent Issued to Zhuhai ACCESS Semiconductor on April 7 for "Embedded packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China).

"Embedded packaging structure and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Yejie Hong (Guangdong, China), Benxia Huang (Guangdong, China) and Gao Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embedded packaging structure and a manufacturing method thereof are disclosed. The method includes: providing a bearing plate with a first metal seed layer; processing on the first metal seed layer to obtain a substrate; removing the bearing plate to obtain the substrate, and processing on the substr...